lead solder
英 [liːd ˈsəʊldə(r)]
美 [liːd ˈsɑːdər]
网络 有铅回焊; 含铅焊锡; 有铅焊锡条
双语例句
- Application: For with lead and lead-free solder billet casting.
适用范围：有铅及无铅焊料棒等的浇铸。 - You should also attach the two leads to the Stainless, using Stainless solid rod ( 1/ 6 dia would do) and USE LEAD FREE SOLDER!
您还应该重视的两个导致不锈钢，使用不锈钢实心棒（1/6直径会做），并使用无铅焊接！ - Resistance strain and temperature hysteresis loops properties of lead free solder joint
无铅焊点的电阻应变温度迟滞回线特性 - To further reduce equivalent series resistance and improve long term reliability, the leads are then soldered with lead free silver solder.
为了进一步的减少等效串联阻抗和改善，长期的信赖度，引线是以无铅银焊锡来接焊。 - Sn-Ag Sn-Zn and Sn-Bi Lead-free Solder
Sn-Ag和Sn-Zn及Sn-Bi系无铅焊料 - Microstructure, wettability and mechanical properties of Sn-Zn-Cu lead free solder
Sn-Zn-Cu无铅钎料的组织、润湿性和力学性能 - Determination of Ge in the Least Soluble Metal Nickle-Base Lead solder
难溶金属镍基钎焊料中锗的测定 - Sn-Bi-Sb Lead Free Solder
Sn-Bi-Sb无铅焊料研究 - High performance electronic lead free solder CWB& 07 series were developed.
研制了一种具有自主知识产权的高性能无铅电子钎料CWB&07系列。 - Determination of phosphorus in tin-lead solder
锡铅焊料中磷的测定 - Extrusion Process and Design of segmental Die for Blank of Resin-cored Tin-lead Solder
锡铅焊丝坯挤压工艺及组合模具设计 - Effect of cerium on wettability and mechanical properties of soldered joints for Sn-Ag-Cu lead free solder
稀土元素Ce对锡银铜无铅钎料润湿性及钎缝力学性能的影响 - The method to make lead free solder bumping using electroplating was expatiated intensively.
重点阐述了采用电镀来制作无铅焊料凸点的方法。 - The Investigation and Analysis About Recent Development and Reliability of electronic Lead Free Solder Technology
无铅电子焊接的最新发展研究及可靠性分析 - Reviews and analyses some relative factors which influence on products quality and reliability, such as Lead free Solder components, and process.
回顾、分析了无铅焊料、元器件及工艺等相关因素对质量和产品可靠性的影响。 - Mixed Soldering with Lead and Lead-free Solder
无铅和有铅的混合焊接 - Current Research and Development of Lead-free Solder
无铅钎料开发研究现状 - Choice of Lead-free Solder and its Countermeasure
无铅焊料的选择与对策 - A new type atomizer designed on the theory of Laval jet is tested in atomization experiment with 63A solder and Sn Ag lead free solder.
根据拉瓦尔喷管原理设计出一种新型低压超音速雾化器，用63A焊锡和SnAg系无铅焊锡进行了雾化试验研究。 - A new type of Sn-Bi-Sb lead free solder has been developed.
开发了一种新型无铅焊料-Sn-Bi-Sb软焊料。 - Simultaneous Dissolution of Tin, Silver and Lead in Tin-Lead Solder Alloy and Their Determinations by ICP-AES
同时溶解和ICP-AES同时测定焊锡材料中的铅、锡和银 - In the process of studying the solder layer, we started from the problem which is most prone to lead failure-the solder voids.
接下来对容易出现问题的焊料层及引线进行了分别的研究。 - Adding rare earth element Ce into solder alloy can improve the wettability of lead free solder.
在钎料合金中加入稀土元素Ce，对无铅钎料的铺展面积有所改善。 - In the case of the same device structure, the stress and strain of lead-free device is bigger than the lead devices '. Big stress and strain can lead to solder joint fracture, crack initiation and growth of chip substrate, eventually leading to device failure.
在器件结构相同的情况下，无铅器件所受应力、应变比有铅器件大，大应力和应变可导致焊点断裂、芯片基板裂纹萌生与生长，最终导致器件失效。 - For the requirements of environmental protection, there is an inevitable trend of lead-free solder taking place of lead solder.
根据环保的要求，无铅钎料取代有铅钎料是必然的趋势。 - To improve the reliability of lead-free devices, people need to find materials which thermal match with the lead-free solder balls or find lead-free materials which physical characteristics and electrical properties are similar to lead solder balls material.
提高无铅器件的可靠性，需要寻找与无铅焊球材料热匹配的其他材料或者与有铅焊球材料物理特性、电学特性相近的无铅焊球材料。 - Tin-based lead-free solder is the ideal alternative to lead solder materials, with the rapid development of electronic industry, high-performance tin-based conductive adhesive, solder paste, especially the development of nano-scale electronic packaging has become the major issue of electronic field.
锡基无铅焊料是目前替代含铅焊料的理想材料，随着电子工业的迅速发展，高性能锡基导电胶、焊膏，特别是纳米级焊剂的开发研究已成为电子封装、电子器件领域的重大课题。 - The stress is the direct cause to lead to solder balls failure, which causes microelectronic devices damage.
应力是导致焊球失效的直接原因，进而致使器件失效。 - As the increasing demand for high-density and environmental protection, the traditional lead solder process is hard to meet these needs.
随着微电子产业对高密度封装和环保的要求与日剧增，传统的铅锡焊工艺越来越不能满足需要。